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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays. 1 /19 datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14? 001 25.july.2012 rev.001 1a variable / fixed output ldo regulator bdxxgc0wefj general description bdxxgc0wefj is a ldo regulator with output current 1.0a. t he output accuracy is 1% of output voltage. with external resistance, it is available to set t he output voltage at random (from 1.5v to 13.0v) and also provides output voltage fixed type without external resistance. it is used for the wide applic ations of digital appliances. it has package type: htsop-j8. over current protection (for pr otecting the ic destruction by output short circ uit), circuit current on /off switch (for setting the circuit 0 a at shutdown mode), and thermal shutdown circuit (f or protecting ic from heat destruction by over load condition) are all built in. it is usable for ceramic capacitor and enables to improve smaller set and long-life. features ? high accuracy reference voltage circuit ? built-in over current protection circuit (ocp) ? built-in thermal shut down circuit (tsd) ? with shut down switch key specifications ? input power supply voltage range: 4.5v to 14.0v ? output voltage range(variable type): 1.5v to 13.0v ? output voltage(fixed type): 1.5v/1.8v/2.5v/3.0v/3.3v 5.0v/6.0v/7.0v/8 .0v/9.0v/10v/12v ? output current: 1.0a(max.) ? shutdown current: 0 a(typ.) ? operating temperature range: -25 to +85 package (typ.) (typ.) (max.) htsop-j8 4.90mm x 6.00 mm x 1.00mm typical application circuit htsop-j8 v o v cc en gnd fin v o_s c out c in c in ,c out : ceramic capacitor r 1 v o v cc en gnd fin r 2 fb c out c in c in ,c out : ceramic capacitor output voltage variable type output voltage fixed type
2/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 ordering information b d x x g c 0 w e f j - e 2 part number output voltage 00:variable 15:1.5v 18:1.8v 25:2.5v 30:3.0v 33:3.3v 50:5.0v 60:6.0v 70:7.0v 80:8.0v 90:9.0v j0:10.0v j2:12.0v voltage resistance g:15v output current c0:1.0a shutdown switch ?w?:built in package efj:htsop-j8 packaging and forming specification e2:emboss tape reel
3/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 block diagram bd00gc0wefj(output voltage variable type) pin configuration pin description pin no. pin name pin function 1 v o output pin 2 fb feedback pin 3 gnd gnd pin 4 n.c. non connection (used to connect gnd or open state.) 5 en enable pin 6 n.c. non connection (used to connect gnd or open state.) 7 n.c. non connection (used to connect gnd or open state.) 8 v cc input pin reverse fin substrate(connect to gnd) fig.1 block diagram top view v o fb gnd n.c. n.c. n.c. en v cc v o v cc soft start
4/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 block diagram bdxxgc0wefj(output voltage fixed type) pin configuration pin description pin no. pin name pin function 1 v o output pin 2 v o_s output voltage monitor pin 3 gnd gnd pin 4 n.c. non connection (used to connect gnd or open state.) 5 en enable pin 6 n.c. non connection (used to connect gnd or open state.) 7 n.c. non connection (used to connect gnd or open state.) 8 v cc input pin reverse fin substrate(connect to gnd) top view v o v o_s gnd n.c. n.c. n.c. en v cc gnd en tsd ocp soft start v o v cc v o_s fig.2 block diagram
5/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 absolute maximum ratings (ta=25 ) parameter symbol limits unit power supply voltage v cc 15.0 * 1 v en voltage v en 15.0 v power dissipation htsop-j8 pd *2 2110 *2 mw operating temperature ra nge topr -25 to +85 storage temperature range tstg -55 to +150 junction temperature tjmax +150 *1 not to exceed pd *2 reduced by 16.9mw/ for each increase in ta of 1 over 25 . (when mounted on a board 70mm 70mm 1.6mm glass-epoxy board, two layer) recommended operating ratings (ta=25 ) parameter symbol min. max. unit input power supply voltage v cc 4.5 14.0 v en voltage v en 0.0 14.0 v output voltage setting range v o 1.5 13.0 v output current i o 0.0 1.0 a electrical characteristics (unless otherwise noted, ta=25 , en=3v, v cc =6v, r 1 =43k , r 2 =8.2k ) parameter symbol min. typ. max. unit conditions circuit current at shutdown mode i sd - 0 5 a v en =0v, off mode bias current i cc - 600 900 a line regulation reg.i -1 0.5 1 % v cc =( v o +0.92v ) 14.0v load regulation reg i o -1.5 0.5 1.5 % i o =0 1.0a minimun dropout voltage v co - 0.6 0.92 v v cc =5v,i o =1.0a output reference voltage(variable type) v fb 0.792 0.800 0.808 v i o =0a output voltage(fixed type) v o v o 0.99 v o v o 1.01 v i o =0a en low voltage v en (low) 0 - 0.8 v en high voltage v en (high) 2.4 - 14.0 v en bias current i en 1 3 9 a
6/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.5 input sequence 1 co=1f typical performance curves (unless otherwise noted, ta=25 , en=3v, v cc =6v, r1=43k , r2=8.2k ) fig.4 transient response (1.0 0a) co=1f fig.6 off sequence 1 co=1f fig.3 transient response (0 1.0a) co=1f v o v o i o i o v en v en v cc v cc v o v o
7/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.9 ta - v o (i o =0ma) fig.10 ta - i cc fig.7 input sequence 2 co=1f fig.8 off sequence 2 co=1f v o v o v cc v cc v en v en v o [v] i cc [a] ta [ ] ta [ ]
8/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.11 ta-isd (v en =0v) fig.13 i o -v o fig.14 v cc -i sd (v en =0v) i sd [a] i en [a] fig.12 ta - i en i sd [a] v cc [v] i o [a] ta [ ] ta [ ] v o [v]
9/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.18 minimum dropout voltage 1 v cc =5v i o =-1.0a fig.15 v cc -v o (i o =0ma) fig.16 tsd (i o =0ma) fig.17 ocp vo[v] i o [a] v o [v] v o [v] v o [v] v cc [v] ta [ ] ta [ ]
10/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.22 minimum dropout voltage 2 v cc =4.5v ta = 2 5 fig.19 esr condencer fig.20 i o -i cc fig.21 psrr (i o =0ma) i o [a] icc[a] i o [a] vdrop [v] p s rr [d b ] i o [a]
11/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 fig.25 minimum dropout voltage 5 v cc =10v ta = 2 5 fig.26 minimum dropout voltage 6 v cc =12v ta = 2 5 vdrop [v] vdrop [v] vdrop [v] vdrop [v] i o [a] i o [a] i o [a] i o [a] fig.24 minimum dropout voltage 4 v cc =8v ta = 2 5 fig.23 minimum dropout voltage 3 v cc =6v ta = 2 5
12/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 power dissipation htsop-j8 thermal design should allow operation within the following condi tions. note that the temperat ures listed are the allowed temperature limits, and thermal design should allow sufficient margin from the limits. 1. ambient temperature ta can be no higher than 85 . 2. chip junction temperature (tj) can be no higher than 150 . chip junction temperature can be determined as follows: most of the heat loss that occurs in the bdxxgc0wefj is generated from the output pch fet. power loss is determined by the total v cc -v o voltage and output current. be sure to confirm the system input and out put voltage and the output current conditions in relation to the heat dissipation characteristics of the v cc and v o in the design. bearing in mind that heat dissipation may vary substantially depending on the substr ate employed (due to the power package incorporated in the bdxxgc0wefj make certain to fa ctor conditions such as substrat e size into the thermal design. power consumption [w] = input voltage (v cc ) - output voltage (v o ) i o (ave) example) where v cc =5.0v, v o =3.3v, i o (ave) = 0.1a, power consumption [w] = 5.0 v - 3.3v 0.1a =0.17[w] calculation based on ambient temperature (ta) tj=ta+ j-a w reference values 1-layer substrate (copper foil density 0mm 0mm) 2-layer substrate (copper foil density 15mm 15mm) 2-layer substrate (copper foil density 70mm 70mm) 4-layer substrate (copper foil density 70mm 70mm) substrate size: 70mm 70mm 1.6mm (substrate with thermal via) j-a: htsop-j8 153.2 /w 113.6 /w 59.2 /w 33.3 /w measure condition: mounted on a rohm board, and ic substrate size: 70mm 70mm 1.6mm (substrate with thermal via) ? solder the substrate and package reverse exposure heat radiation part ic only j-a=249.5 /w 1-layer copper foil are :0mm 0mm j-a=153.2 /w 2-layer copper foil are :15mm 15mm j-a=113.6 /w 2-layer copper foil are :70mm 70mm j-a=59.2 /w 4-layer copper foil are :70mm 70mm j-a=33.3 /w power dissipation :pd [w] 0 25 50 75 100 125 150 0 2.0 3.0 4.0 0.50w ?? :ta [ ] 1.0 0.82w 1.10w 2.11w 3.76w ambient temperature :ta [ ]
13/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 input-to-output capacitor it is recommended that a capacitor is placed nearby pin between input pin and g nd, output pin and gnd. a capacitor, between input pin and gnd, is valid when the power supply impedance is high or drawing is long. also as for a capacitor, between output pin and gnd, the greater the capacity, more sustai nable the line regulation and it makes improvement of characteristics by load c hange. however, please check by mounted on a board for the actual application. ceramic capacitor usually has difference, thermal characterist ics and series bias characteristics, and moreover capacity decreases gradually by using conditions. for more detail, please be sure to inquire the m anufacturer, and select the best ceramic capacitor. equivalent series resistance esr (ceramic capacitor etc.) please attach an anti-oscillation capacitor between v o and gnd. capacitor usually has esr(equivalent series resistance), and operates stable in esr-i o range, showed right. generally, esr of ceramic, tantalum and electronic capacitor etc. is different for each, so please be sure to check a capacitor which is going to use, and use it inside the stable operating region, showed right. then, please evaluate for the actual application. esr ? i o characteristics 0.01 0.10 1.00 10.00 0 0.2 0.4 0.6 0.8 1 io [a] esr [ ] safety area dc bias voltage [v] ceramic capacitor capacity ? dc bias characteristics (characteristics example) -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 0 1 2 3 4 rated voltage 10v b1 characteristics rated voltage 4v x6s characteristics capacitance change [%] rated voltage:10v f characteristics rated voltage 6.3v b characteristics b characteristics rated voltage 10v c o =1 f
14/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 evaluation board circuit evaluation board parts list board layout ? input capacitor c in of v cc (v in ) should be placed very close to v cc (v in ) pin as possible, and used broad wiring pattern. output capacitor c out also should be placed close to ic pin as possible. in case connected to inner layer gnd plane, please use several through hole. ? fb pin has comparatively high impedance, and is apt to be effe cted by noise, so floating capacity should be minimum as possible. please be careful in wiring drawing ? please take gnd pattern space widely, and design layout to be able to increase radiation efficiency. ? for output voltage setting(bd00gc0wefj) output voltage can be set by fb pin voltage 0.800v typ. and external resistance r1, r2. the use of resistors with r1+r2=1k to 90k is recommended designation value part no. company designation value part no. company r1 43k mcr01pzpzf4302 rohm c4 \ \ \ r2 8.2k mcr01pzpzf8201 rohm c5 1 f cm105b105k16a kyocera r3 \ \ \ c6 r4 \ \ \ c7 \ \ \ r5 \ \ \ c8 \ \ \ r6 \ \ \ c9 \ \ \ c1 1 f cm105b105k16a kyocera c10 \ \ \ c2 \ \ u1 \ bd00gc0wefj rohm c3 \ \ u2 \ \ \ v o = v fb r1+r2 r2 n.c gnd fb n.c n.c. v o 2 v o c7 3 4 7 5 u1 8 c1 c2 c3 r1 r2 c6 c5 1 v cc 6 en gnd sw1 en fin v o en gnd ( v cc v in ) c in r 1 r2 c out
15/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 i/o equivalent circuits (output voltage vairable type) i/o equivalent circuits (output voltage fixed type) 8pin (v cc ) / 1pin (v o ) 2pin (fb) 5pin (en) 2pin (fb) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m 8pin (v cc ) / 1pin (v o ) 2pin (v o_s ) 5pin (en) 2pin (v o_s ) 8pin (v cc ) 1pin (v o ) 5pin (en) 1m 2m
16/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 operational notes (1). absolute maximum ratings an excess in the absolute maximum ratings, such as supply voltage, temperature ra nge of operating conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. if any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses. (2). connecting the power supply connector backward connecting of the power supply in reverse polarity c an damage ic. take precautions when connecting the power supply lines. an external direction diode can be added. (3). power supply lines design pcb layout pattern to provide low impedance gnd and supply lines. to obtain a low noise ground and supply line, separate the ground section and supply lines of the digital and analog blocks. furthermore, for all power supply terminals to ics, connect a capacitor between the power supply and the gnd terminal. when applying electrolytic capacitors in the circuit, not that capacitanc e characteristic values are reduced at low temperatures. (4). gnd voltage the potential of gnd pin must be minimum potential in all operating conditions. (5). thermal design use a thermal design that allows for a sufficient margin in light of the power dissipati on (pd) in actual operating conditions. (6). inter-pin shorts and mounting errors use caution when positioning the ic fo r mounting on printed circuit boards. the ic may be damaged if there is any connection error or if pins are shorted together. (7). actions in strong electromagnetic field use caution when using the ic in the pr esence of a strong electromagnetic field as doing so may cause the ic to malfunction. (8). aso when using the ic, set the output transistor so that it does not exceed absolute maximum ratings or aso. (9). thermal shutdown circuit the ic incorporates a built-in thermal shutdown circuit (tsd circuit). the thermal shutdown circuit (tsd circuit) is designed only to shut the ic off to prevent thermal runawa y. it is not designed to prot ect the ic or guarantee its operation. do not continue to use t he ic after operating this circuit or use the ic in an environment where the operation of this circuit is assumed. (10). testing on application boards when testing the ic on an application boar d, connecting a capacitor to a pin with low impedance subjects the ic to stress. always discharge capacitors after each proce ss or step. always turn the ic?s power supply off before connecting it to or removing it from a jig or fixture during the inspection process. ground the ic during assembly steps as an antistatic measure. use similar precaution when transporti ng or storing the ic. tsd on temperature[ ] (typ.) hysteresis temperature [ ] (typ.) bdxxgc0wefj 175 15
17/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 (11). regarding input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of these p layers with the n layers of other elements, creating a parasitic diode or transistor. for example, the relation between each potential is as follows: when gnd > pin a and gnd > pin b, the p-n j unction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes can occur inevitable in the structure of the ic. the operation of parasitic diodes can result in mutual in terference among circuits, operational faults, or physical damage. accordingly, methods by which parasitic diodes operate, such as applying a vo ltage that is lower than the gnd (p substrate) voltage to an input pin, should not be used. (12). ground wiring pattern. when using both small signal and large current gnd patterns, it is recommended to isolate the two ground patterns, placing a single ground point at the grou nd potential of application so that t he pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage. be careful not to change the gnd wiring pattern of any external components, either. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority. resistor transistor (npn) parasitic element n n n p + p + p p substrate gnd pin a n n p + p + p p substrate gnd parasitic element pin b c b e n gnd pin a p aras iti c element pin b other adjacent elements e b c gnd p aras iti c element
18/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 physical dimension tape and reel information marking diagram xx product name 00 bd00gc0wefj 15 bd15gc0wefj 18 bd18gc0wefj 25 bd25gc0wefj 30 bd30gc0wefj 33 bd33gc0wefj 50 bd50gc0wefj 60 bd60gc0wefj 70 BD70GC0WEFJ 80 bd80gc0wefj 90 bd90gc0wefj j0 bdj0gc0wefj j2 bdj2gc0wefj (unit : mm) htsop-j8 0.08 s 0.08 m s 1.0max 0.850.05 1.27 0.080.08 0.42 +0.05 - 0.04 1.050.2 0.650.15 4 + 6 ? 4 0.17 +0.05 - 0.03 234 568 (max 5.25 include burr) 7 1 0.545 (3.2) 4.90.1 6.00.2 (2.4) 3.90.1 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin htsop-j8 (top view) xxgc0w part number marking lot number 1pin mark
19/19 bdxxgc0wefj datasheet tsz02201-0r6r0a600200-1-2 ? 2012 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15? 001 25.july.2012 rev.001 revision history date revision changes 25.july.2012 001 new release
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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